IndiumV3, Main, Repository, bibRecord, 002A97

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

Identifieur interne : 002A97 ( Main/Repository ); précédent : 002A96; suivant : 002A98

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

Auteurs : RBID : Pascal:11-0308325

Descripteurs français

Pascal (Inist)
- Cinétique, Assemblage brasage tendre, Addition bismuth, Brasage tendre, Cuivre, Convection, Microscopie optique, Spectrométrie dispersive, Spectre RX, Microanalyse, Vieillissement, Taux croissance, Diffusion(transport), Joint grain, Composé intermétallique, Interface, Etat solide, Défaut cristallin, Indium, Constante vitesse, Mécanisme croissance, Composition chimique, Métallurgie soudage, SnAgCu, Substrat cuivre, Cu3Sn, Cu6Sn5, 8130H, 8130M, Brasure sans plomb.
Wicri :
- concept : Cuivre.

English descriptors

KwdEn :
- Ageing, Bismuth addition, Chemical composition, Convection, Copper, Crystal defect, Diffusion, Dispersive spectrometry, Grain boundary, Growth mechanism, Growth rate, Indium, Interface, Intermetallic compound, Kinetics, Lead free solder, Microanalysis, Optical microscopy, Rate constant, Soldered joint, Soldering, Solid state, Welding metallurgy, X ray spectrum.

Abstract

The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 _°C for 5 s. The joints were subsequently aged at temperatures of 130-170°Cfor 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu₃Sn and Cu₆Sn₅. Cu₆Sn₅ is formed during soldering. Cu₃Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu₃Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu₆(Sn,In)₅ instead of Cu₆Sn₅, with a higher rate constant. The mechanism of the Cu₆(Sn,In)₅ layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.

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Le document en format XML

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Bi, In) solders with Cu substrate</title>
<author><name sortKey="Hodulova, Erika" uniqKey="Hodulova E">Erika Hodulova</name>
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<author><name sortKey="Palcut, Marian" uniqKey="Palcut M">Marian Palcut</name>
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<author><name sortKey="Lechovic, Emil" uniqKey="Lechovic E">Emil Lechovic</name>
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<author><name sortKey="Simekova, Beata" uniqKey="Simekova B">Beata Simekova</name>
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<author><name sortKey="Ulrich, Koloman" uniqKey="Ulrich K">Koloman Ulrich</name>
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<date when="2011">2011</date>
<idno type="stanalyst">PASCAL 11-0308325 INIST</idno>
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<seriesStmt><idno type="ISSN">0925-8388</idno>
<title level="j" type="abbreviated">J. alloys compd.</title>
<title level="j" type="main">Journal of alloys and compounds</title>
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<term>Bismuth addition</term>
<term>Chemical composition</term>
<term>Convection</term>
<term>Copper</term>
<term>Crystal defect</term>
<term>Diffusion</term>
<term>Dispersive spectrometry</term>
<term>Grain boundary</term>
<term>Growth mechanism</term>
<term>Growth rate</term>
<term>Indium</term>
<term>Interface</term>
<term>Intermetallic compound</term>
<term>Kinetics</term>
<term>Lead free solder</term>
<term>Microanalysis</term>
<term>Optical microscopy</term>
<term>Rate constant</term>
<term>Soldered joint</term>
<term>Soldering</term>
<term>Solid state</term>
<term>Welding metallurgy</term>
<term>X ray spectrum</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr"><term>Cinétique</term>
<term>Assemblage brasage tendre</term>
<term>Addition bismuth</term>
<term>Brasage tendre</term>
<term>Cuivre</term>
<term>Convection</term>
<term>Microscopie optique</term>
<term>Spectrométrie dispersive</term>
<term>Spectre RX</term>
<term>Microanalyse</term>
<term>Vieillissement</term>
<term>Taux croissance</term>
<term>Diffusion(transport)</term>
<term>Joint grain</term>
<term>Composé intermétallique</term>
<term>Interface</term>
<term>Etat solide</term>
<term>Défaut cristallin</term>
<term>Indium</term>
<term>Constante vitesse</term>
<term>Mécanisme croissance</term>
<term>Composition chimique</term>
<term>Métallurgie soudage</term>
<term>SnAgCu</term>
<term>Substrat cuivre</term>
<term>Cu3Sn</term>
<term>Cu6Sn5</term>
<term>8130H</term>
<term>8130M</term>
<term>Brasure sans plomb</term>
</keywords>
<keywords scheme="Wicri" type="concept" xml:lang="fr"><term>Cuivre</term>
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<front><div type="abstract" xml:lang="en">The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 <sub>°</sub>
C for 5 s. The joints were subsequently aged at temperatures of 130-170°C<sub> </sub>
for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu<sub>3</sub>
Sn and Cu<sub>6</sub>
Sn<sub>5</sub>
. Cu<sub>6</sub>
Sn<sub>5</sub>
 is formed during soldering. Cu<sub>3</sub>
Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu<sub>3</sub>
Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu<sub>6</sub>
(Sn,In)<sub>5</sub>
 instead of Cu<sub>6</sub>
Sn<sub>5</sub>
, with a higher rate constant. The mechanism of the Cu<sub>6</sub>
(Sn,In)<sub>5</sub>
 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.</div>
</front>
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<fC01 i1="01" l="ENG"><s0>The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 <sub>°</sub>
C for 5 s. The joints were subsequently aged at temperatures of 130-170°C<sub> </sub>
for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu<sub>3</sub>
Sn and Cu<sub>6</sub>
Sn<sub>5</sub>
. Cu<sub>6</sub>
Sn<sub>5</sub>
 is formed during soldering. Cu<sub>3</sub>
Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu<sub>3</sub>
Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu<sub>6</sub>
(Sn,In)<sub>5</sub>
 instead of Cu<sub>6</sub>
Sn<sub>5</sub>
, with a higher rate constant. The mechanism of the Cu<sub>6</sub>
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 layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.</s0>
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<s5>01</s5>
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<fC03 i1="01" i2="X" l="SPA"><s0>Cinética</s0>
<s5>01</s5>
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<fC03 i1="02" i2="X" l="FRE"><s0>Assemblage brasage tendre</s0>
<s5>02</s5>
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<fC03 i1="02" i2="X" l="ENG"><s0>Soldered joint</s0>
<s5>02</s5>
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<fC03 i1="02" i2="X" l="GER"><s0>Weichloetverbindung</s0>
<s5>02</s5>
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<fC03 i1="02" i2="X" l="SPA"><s0>Junta soldada</s0>
<s5>02</s5>
</fC03>
<fC03 i1="03" i2="X" l="FRE"><s0>Addition bismuth</s0>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="ENG"><s0>Bismuth addition</s0>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="GER"><s0>Bismutzusatz</s0>
<s5>03</s5>
</fC03>
<fC03 i1="03" i2="X" l="SPA"><s0>Adición bismuto</s0>
<s5>03</s5>
</fC03>
<fC03 i1="04" i2="X" l="FRE"><s0>Brasage tendre</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="ENG"><s0>Soldering</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="GER"><s0>Weichloeten</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="SPA"><s0>Soldeo blando</s0>
<s5>04</s5>
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<fC03 i1="05" i2="X" l="FRE"><s0>Cuivre</s0>
<s2>NC</s2>
<s5>05</s5>
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<fC03 i1="05" i2="X" l="ENG"><s0>Copper</s0>
<s2>NC</s2>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="GER"><s0>Kupfer</s0>
<s2>NC</s2>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="SPA"><s0>Cobre</s0>
<s2>NC</s2>
<s5>05</s5>
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<fC03 i1="06" i2="X" l="FRE"><s0>Convection</s0>
<s5>06</s5>
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<fC03 i1="06" i2="X" l="ENG"><s0>Convection</s0>
<s5>06</s5>
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<fC03 i1="06" i2="X" l="GER"><s0>Konvektion</s0>
<s5>06</s5>
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<fC03 i1="06" i2="X" l="SPA"><s0>Convección</s0>
<s5>06</s5>
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<s5>07</s5>
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<s5>07</s5>
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<s5>07</s5>
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<fC03 i1="07" i2="X" l="SPA"><s0>Microscopía óptica</s0>
<s5>07</s5>
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<fC03 i1="08" i2="X" l="FRE"><s0>Spectrométrie dispersive</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="ENG"><s0>Dispersive spectrometry</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="SPA"><s0>Espectrometría dispersiva</s0>
<s5>08</s5>
</fC03>
<fC03 i1="09" i2="X" l="FRE"><s0>Spectre RX</s0>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG"><s0>X ray spectrum</s0>
<s5>09</s5>
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<fC03 i1="09" i2="X" l="SPA"><s0>Espectro RX</s0>
<s5>09</s5>
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<fC03 i1="10" i2="X" l="FRE"><s0>Microanalyse</s0>
<s5>10</s5>
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<s5>10</s5>
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<s5>11</s5>
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<s5>11</s5>
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<fC03 i1="11" i2="X" l="GER"><s0>Altern</s0>
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<s5>13</s5>
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<s5>13</s5>
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<fC03 i1="14" i2="X" l="FRE"><s0>Joint grain</s0>
<s5>14</s5>
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<fC03 i1="14" i2="X" l="ENG"><s0>Grain boundary</s0>
<s5>14</s5>
</fC03>
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<s5>14</s5>
</fC03>
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<s5>14</s5>
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<s5>15</s5>
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<fC03 i1="15" i2="X" l="ENG"><s0>Intermetallic compound</s0>
<s5>15</s5>
</fC03>
<fC03 i1="15" i2="X" l="GER"><s0>Intermetallische Verbindung</s0>
<s5>15</s5>
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<s5>15</s5>
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<fC03 i1="16" i2="X" l="FRE"><s0>Interface</s0>
<s5>16</s5>
</fC03>
<fC03 i1="16" i2="X" l="ENG"><s0>Interface</s0>
<s5>16</s5>
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<fC03 i1="16" i2="X" l="GER"><s0>Grenzflaeche</s0>
<s5>16</s5>
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<fC03 i1="16" i2="X" l="SPA"><s0>Interfase</s0>
<s5>16</s5>
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<fC03 i1="17" i2="X" l="FRE"><s0>Etat solide</s0>
<s5>17</s5>
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<fC03 i1="17" i2="X" l="ENG"><s0>Solid state</s0>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="X" l="GER"><s0>Fester Zustand</s0>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="X" l="SPA"><s0>Estado sólido</s0>
<s5>17</s5>
</fC03>
<fC03 i1="18" i2="X" l="FRE"><s0>Défaut cristallin</s0>
<s5>29</s5>
</fC03>
<fC03 i1="18" i2="X" l="ENG"><s0>Crystal defect</s0>
<s5>29</s5>
</fC03>
<fC03 i1="18" i2="X" l="SPA"><s0>Defecto cristalino</s0>
<s5>29</s5>
</fC03>
<fC03 i1="19" i2="X" l="FRE"><s0>Indium</s0>
<s2>NC</s2>
<s5>30</s5>
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<fC03 i1="19" i2="X" l="ENG"><s0>Indium</s0>
<s2>NC</s2>
<s5>30</s5>
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<fC03 i1="19" i2="X" l="GER"><s0>Indium</s0>
<s2>NC</s2>
<s5>30</s5>
</fC03>
<fC03 i1="19" i2="X" l="SPA"><s0>Indio</s0>
<s2>NC</s2>
<s5>30</s5>
</fC03>
<fC03 i1="20" i2="X" l="FRE"><s0>Constante vitesse</s0>
<s5>31</s5>
</fC03>
<fC03 i1="20" i2="X" l="ENG"><s0>Rate constant</s0>
<s5>31</s5>
</fC03>
<fC03 i1="20" i2="X" l="SPA"><s0>Constante velocidad</s0>
<s5>31</s5>
</fC03>
<fC03 i1="21" i2="X" l="FRE"><s0>Mécanisme croissance</s0>
<s5>32</s5>
</fC03>
<fC03 i1="21" i2="X" l="ENG"><s0>Growth mechanism</s0>
<s5>32</s5>
</fC03>
<fC03 i1="21" i2="X" l="GER"><s0>Wachstumsmechanismus</s0>
<s5>32</s5>
</fC03>
<fC03 i1="21" i2="X" l="SPA"><s0>Mecanismo crecimiento</s0>
<s5>32</s5>
</fC03>
<fC03 i1="22" i2="X" l="FRE"><s0>Composition chimique</s0>
<s5>33</s5>
</fC03>
<fC03 i1="22" i2="X" l="ENG"><s0>Chemical composition</s0>
<s5>33</s5>
</fC03>
<fC03 i1="22" i2="X" l="GER"><s0>Chemische Zusammensetzung</s0>
<s5>33</s5>
</fC03>
<fC03 i1="22" i2="X" l="SPA"><s0>Composición química</s0>
<s5>33</s5>
</fC03>
<fC03 i1="23" i2="X" l="FRE"><s0>Métallurgie soudage</s0>
<s5>34</s5>
</fC03>
<fC03 i1="23" i2="X" l="ENG"><s0>Welding metallurgy</s0>
<s5>34</s5>
</fC03>
<fC03 i1="23" i2="X" l="GER"><s0>Schweissmetallurgie</s0>
<s5>34</s5>
</fC03>
<fC03 i1="23" i2="X" l="SPA"><s0>Metalurgia soldadura</s0>
<s5>34</s5>
</fC03>
<fC03 i1="24" i2="X" l="FRE"><s0>SnAgCu</s0>
<s4>INC</s4>
<s5>46</s5>
</fC03>
<fC03 i1="25" i2="X" l="FRE"><s0>Substrat cuivre</s0>
<s4>INC</s4>
<s5>47</s5>
</fC03>
<fC03 i1="26" i2="X" l="FRE"><s0>Cu3Sn</s0>
<s4>INC</s4>
<s5>48</s5>
</fC03>
<fC03 i1="27" i2="X" l="FRE"><s0>Cu6Sn5</s0>
<s4>INC</s4>
<s5>49</s5>
</fC03>
<fC03 i1="28" i2="X" l="FRE"><s0>8130H</s0>
<s4>INC</s4>
<s5>65</s5>
</fC03>
<fC03 i1="29" i2="X" l="FRE"><s0>8130M</s0>
<s4>INC</s4>
<s5>66</s5>
</fC03>
<fC03 i1="30" i2="X" l="FRE"><s0>Brasure sans plomb</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fC03 i1="30" i2="X" l="ENG"><s0>Lead free solder</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fN21><s1>213</s1>
</fN21>
</pA>
</standard>
</inist>
</record>

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Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

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